Thermal paste high conductivity

Thermal paste Low thermal impedance Resists dripping Long service life

It is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices .

Applications:

Automotive electronics

Telecommunications

 Computer and peripherals

Thermally conductive vibration dampening

 Between any heat-generating semiconductor and a heat sink

Usage:

Clean impurity on the smearing surface, use scraper, brush, glass bar or injector to smear or fill in the object.

Physical Properties:

PROPERTY	G-200	G-300	G-500	TEST METHOD	UNIT
Density	2.3	2.7	3.2	ASTM D792	---
Color	Gray	Gray	Gray	---	Visual
Volatile Content	0.5	0.3	0.2	ASTM E595	%/Wt
Thermal Conductivity	2.0	3.0	5.0	ASTM D5470	W/mK
Thermal Resistance	0.041	0.025	0.009	ASTM D5470	C-In2/W
Breakdown Voltage	1100	1000	600	ASTM D149	VAC/mil
Dielectric Constant	4.5	4.7	4.8	ASTM D150	---
Volume Voltage	>1013	>1013	>1012	ASTM D257	---
Work Temp	-50°C to 200°C

Thermal paste high conductivity